Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14435955
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Filing Dt:
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04/15/2015
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Publication #:
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Pub Dt:
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11/19/2015
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Inventors:
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Anna ZHANG, Xiaoming LI
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Title:
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METHOD FOR WAFER ETCHING IN DEEP SILICON TRENCH ETCHING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8 XINZHOU ROAD |
| WUXI NEW DISTRICT |
| JIANGSU 214028, CHINA |
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| WIDERMAN MALEK, PL |
| 1990 W. NEW HAVEN AVE. |
| SUITE 201 |
| MELBOURNE, FL 32904 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO.8 XINZHOU ROAD |
| WUXI NEW DISTRICT |
| JIANGSU, CHINA 214028 |
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| WIDERMAN MALEK, PL |
| 1990 WEST NEW HAVEN AVE. |
| SECOND FLOOR |
| MELBOURNE, FL 32904 |
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