Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14795914
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Filing Dt:
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07/10/2015
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Publication #:
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Pub Dt:
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11/19/2015
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Inventors:
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Kambiz Samadi, Shreepad Amar Panth, Pratyush Kamal, Yang Du
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Title:
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PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) USING CLUSTERING TO INCREASE USABLE WHITESPAC
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| W&T/QUALCOMM |
| 100 REGENCY FOREST DRIVE |
| SUITE 160 |
| CARY, NC 27518 |
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