Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/23/2016
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Application #:
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14292162
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Filing Dt:
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05/30/2014
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Publication #:
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Pub Dt:
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12/03/2015
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Inventors:
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Chung-Liang CHENG, Yen-Yu CHEN, Chang-Sheng LEE, Wei ZHANG
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Title:
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PLANARIZATION METHOD, METHOD FOR POLISHING WAFER, AND CMP SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DODDAKANNELLI |
| SARJAPUR ROAD |
| BANGALORE, INDIA 560 035 |
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| LECLAIRRYAN |
| 70 LINDEN OAKS |
| SUITE 210 |
| ROCHESTER, NY 14625 |
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