Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2016
|
Application #:
|
14516223
|
Filing Dt:
|
10/16/2014
|
|
Publication #:
|
|
Pub Dt:
|
12/03/2015
| | | | |
|
Inventors:
|
Jung Tae JEONG, Si Eon KIM, Jong Woo AHN
|
|
Title:
|
FLIP CHIP PACKAGES HAVING CHIP FIXING STRUCTURES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON, KOREA, REPUBLIC OF 467-734 |
|
|
|
|
| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST. SW |
| SUITE 580 |
| MOUNTLAKE TERRACE, WA 98043 |
|
|
Search Results as of:
06/04/2024 05:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
