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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/05/2017
Application #:
14654758
Filing Dt:
06/22/2015
Publication #:
Pub Dt:
12/10/2015
Inventors:
Keishi Ono, Keiko Suzuki, Etsuharu Suzuki, Tetsuya Enomoto, Masayuki Ohe, Kazuya Soejima
Title:
POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION
Assignment: 1
Reel/Frame:
035877/0607Recorded: 06/22/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/30/2015
Exec Dt:
03/24/2015
Exec Dt:
03/30/2015
Exec Dt:
03/30/2015
Exec Dt:
03/30/2015
Exec Dt:
03/30/2015
Assignee:
4-25, KORAKU 1-CHOME, BUNKYO-KU
TOKYO, JAPAN 112-0004
Correspondent:
GRIFFIN & SZIPL, PC
SUITE 112
2300 NINTH STREET, SOUTH
ARLINGTON, VA 22204

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