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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/12/2016
Application #:
14829808
Filing Dt:
08/19/2015
Publication #:
Pub Dt:
12/10/2015
Inventors:
Tatsuro Takagaki, Yasunori Iwasaki, Sugio Miyazawa, Akiyoshi Ide, Hirokazu Nakanishi
Title:
Handle Substrate and Composite Wafer for Semiconductor Device
Assignment: 1
Reel/Frame:
036358/0301Recorded: 08/19/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/29/2015
Exec Dt:
07/29/2015
Exec Dt:
08/04/2015
Exec Dt:
07/29/2015
Exec Dt:
07/29/2015
Assignee:
2-56, SUDA-CHO, MIZUHO-KU, NAGOYA-CITY
AICHI-PREFECTURE, JAPAN 467-8530
Correspondent:
TOMOKO NAKAJIMA
CERMAK NAKAJIMA & MCGOWAN LLP,
127 S. PEYTON ST., SUITE 200
ALEXANDRIA, VA 22314

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