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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/22/2017
Application #:
14766981
Filing Dt:
08/10/2015
Publication #:
Pub Dt:
12/10/2015
Inventors:
Katsuhiko Kawabata, Takuma Hayashi, Mitsumasa Ikeuchi, Sungjae Lee, Jin Kunika
Title:
SUBSTRATE ETCHING APPARATUS AND SUBSTRATE ANALYSIS METHOD
Assignment: 1
Reel/Frame:
036293/0705Recorded: 08/11/2015Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/30/2015
Exec Dt:
06/30/2015
Exec Dt:
06/30/2015
Exec Dt:
06/30/2015
Exec Dt:
06/30/2015
Assignee:
4-39-5-916, FUJIMIDAI, KUNITACHI-SHI
TOKYO, JAPAN 186-0003
Correspondent:
ROBERTS & ROBERTS, LLP, ATTORNEYS AT LAW
P.O. BOX 484
PRINCETON, NJ 08542-0484

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