Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/06/2017
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Application #:
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14596770
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Filing Dt:
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01/14/2015
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Publication #:
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Pub Dt:
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12/10/2015
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Inventors:
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Sang-hun Jeon, Ho-jin Chun, Hyun-seok Cha, Jae-hoon Heo, Young-deok Kim
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Title:
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Printed Circuit Boards and Semiconductor Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONTONG-GU |
| GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 443-742 |
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| MYERS BIGEL SIBLEY & SAJOVEC, P.A. |
| 4140 PARKLAKE AVENUE |
| SUITE 600 |
| RALEIGH, NC 27612 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE STREET ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED AT REEL: 034724 FRAME: 0474. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 443-742 |
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| MYERS BIGEL SIBLEY & SAJOVEC, P.A. |
| P.O. BOX 37428 |
| RALEIGH, NC 27627 |
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