Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/09/2017
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Application #:
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14457356
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Filing Dt:
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08/12/2014
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Publication #:
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Pub Dt:
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12/10/2015
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Inventor:
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Diann-Fang LIN
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Title:
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PACKAGING STRUCTURE FOR THIN DIE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 118, CHUNG-HUA RD. |
| CHU-NAN |
| MIAO-LI, TAIWAN 350 |
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| LOWE HAUPTMAN & HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO.81, SEC. 2, GONGDAO 5TH RD. |
| PUDING VIL., EAST DIST. |
| HSINCHU CITY, TAIWAN 30070 |
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| JONATHAN P SOIFER |
| SANDBERG PHOENIX & VON GONTARD, P.C. |
| 120 S. CENTRAL AVE., SUITE 1600 |
| CLAYTON, MO 63105 |
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