Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/03/2018
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Application #:
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14432195
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Filing Dt:
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03/27/2015
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Publication #:
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Pub Dt:
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12/10/2015
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PCT #:
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CN2014076585
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Inventors:
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Saeed S. Shojaie, Junfeng Zhao, Cheng Yang
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Title:
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INTEGRATED CIRCUIT ASSEMBLIES WITH MOLDING COMPOUND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWABE, WILLIAMSON & WYATT, P.C. |
| 1211 SW 5TH AVENUE, SUITE 1900 |
| PORTLAND, OR 97204 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3101 N. 1ST STREET |
| SAN JOSE, CALIFORNIA 95134 |
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| BYRNE POH LLP |
| 400 RELLA BLVD |
| STE 165 #106 |
| SUFFERN, NY 10901 |
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