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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14302234
Filing Dt:
06/11/2014
Publication #:
Pub Dt:
12/17/2015
Inventors:
Samuel S. Pak, Sang In Lee, Daniel Ho Lee, Hyoseok Daniel Yang
Title:
Linear Deposition Apparatus with Modular Assembly
Assignment: 1
Reel/Frame:
033091/0231Recorded: 06/12/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/09/2014
Exec Dt:
06/09/2014
Exec Dt:
06/09/2014
Exec Dt:
06/09/2014
Assignee:
3191 LAURELVIEW COURT
FREMONT, CALIFORNIA 94538
Correspondent:
DOHYUN AHN
FENWICK & WEST LLP
801 CALIFORNIA STREET
MOUNTAIN VIEW, CA 94041

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