Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14732994
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Filing Dt:
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06/08/2015
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Publication #:
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Pub Dt:
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12/17/2015
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Inventors:
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Toshio Komiyatani, Takayuki Baba, Shu Okasaka, Koji Koizumi
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Title:
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METAL FOIL-CLAD SUBSTRATE, CIRCUIT BOARD AND ELECTRONIC-COMPONENT MOUNTING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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| WESTERMAN, HATTORI, DANIELS&ADRIAN, LLP. |
| 1250 CONNECTICUT AVE., NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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