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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/14/2017
Application #:
14503067
Filing Dt:
09/30/2014
Publication #:
Pub Dt:
12/31/2015
Inventors:
Carlos A.S. RIBAS, Michael ENG, Shankar S. PENNATHUR, Deniz TEOMAN
Title:
THERMAL SOLUTIONS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE ELECTRONIC DEVICES
Assignment: 1
Reel/Frame:
034664/0489Recorded: 01/08/2015Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/07/2015
Exec Dt:
12/17/2014
Exec Dt:
10/30/2014
Exec Dt:
12/15/2014
Assignee:
1 INFINITE LOOP
CUPERTINO, CALIFORNIA 95014
Correspondent:
JEAN NGUYEN
707 WILSHIRE BLVD
LOS ANGELES, CA 90017-3543

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