Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2017
|
Application #:
|
14322054
|
Filing Dt:
|
07/02/2014
|
|
Publication #:
|
|
Pub Dt:
|
01/07/2016
| | | | |
|
Inventor:
|
Tin Tun
|
|
Title:
|
SELECTIVE COMPONENT BONDING TECHNIQUE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
|
|
|
|
| MARIAN E. SILBERSTEIN, PH.D. |
| SEED IP LAW GROUP |
| SEATTLE, WA 98104 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
|
|
|
|
| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE |
| SUITE 300 |
| COPPELL, TX 75019 |
|
|
Search Results as of:
05/27/2024 09:48 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
