Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14520354
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Filing Dt:
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10/22/2014
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Publication #:
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Pub Dt:
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01/07/2016
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Inventors:
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Yu Lin Yang, Ya Tzu WU
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Title:
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INTEGRATED CIRCUIT ASSEMBLY AND INTEGRATED CIRCUIT PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| RM. 1, 14F., NO.8, TAIYUAN 1ST ST., ZHUBEI CITY, |
| HSINCHU COUNTY, TAIWAN 302 |
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| HDLS IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE OF ASSIGNEE PREVIOUSLY RECORDED AT REEL: 033997 FRAME: 0921. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 14F, NO.8, TAI YUEN 1ST STREET, CHUPEI CITY, |
| HSINCHU, TAIWAN 302 |
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| HDLS IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
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