Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14790994
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Filing Dt:
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07/02/2015
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Publication #:
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Pub Dt:
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01/07/2016
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Inventors:
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Myung-Sam KANG, Seung-Yeop KOOK, Young-Kwan LEE, Seung-Eun LEE, Jun-Oh HWANG et al
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Title:
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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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