Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/07/2017
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Application #:
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14859627
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Filing Dt:
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09/21/2015
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Publication #:
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Pub Dt:
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01/14/2016
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Inventors:
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Konosuke Hayashi, Daisuke Matsushima
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Title:
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BONDING APPARATUS AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, KASAMA 2-CHOME, SAKAE-KU |
| YOKOHAMA-SHI, KANAGAWA-KEN, JAPAN |
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| BANNER & WITCOFF, LTD. |
| 1100 13TH ST. NW |
| STE 1200 |
| WASHINGTON, DC 20005 |
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