Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/14/2017
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Application #:
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14336305
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Filing Dt:
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07/21/2014
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Publication #:
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Pub Dt:
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01/21/2016
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Inventors:
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Choo Tian Ooi, Klaus Elian, Chew Theng Tai, Mohd Hirzarul Hafiz Mohd Tahir
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Title:
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MOLDED SENSOR PACKAGE WITH AN INTEGRATED MAGNET AND METHOD OF MANUFACTURING MOLDED SENSOR PACKAGES WITH AN INTEGRATED MAGNET
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 8000 REGENCY PARKWAY |
| SUITE 415 |
| CARY, NC 27518 |
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