Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/23/2019
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Application #:
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14751134
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Filing Dt:
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06/26/2015
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Publication #:
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Pub Dt:
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01/21/2016
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Inventors:
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Jerry LIU, Phil WU, Herb He HUANG
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Title:
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vertically integrated three-dimensional cmos image sensors (3d cis) bonded with control circuit substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 ZHANG JIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| KILPATRICK TOWNSEND AND STOCKTON LLP |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 ZHANGJIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| 9TH FLOOR, NO. 700 SIMINGSHAN ROAD, BEILUN DISTRICT |
| NINGBO, CHINA 315800 |
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| ANOVA LAW GROUP PLLC |
| 21495 RIDGETOP CIRCLE, SUITE 300 |
| STERLING, VA 20166 |
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