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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9570497
Issue Dt:
02/14/2017
Application #:
14875002
Filing Dt:
10/05/2015
Publication #:
20160027836
Pub Dt:
01/28/2016
Inventors:
Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng
Title:
BACK SIDE ILLUMINATED IMAGE SENSOR HAVING ISOLATED BONDING PADS
Assignment: 1
Reel/Frame:
036728/0682Recorded: 10/05/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TSAI, SHUANG-JI
Exec Dt:
02/09/2011
YUANG, DUN-NIAN
Exec Dt:
02/09/2011
LIU, JEN-CHENG
Exec Dt:
02/09/2011
WANG, WEN-DEN
Exec Dt:
02/09/2011
TSENG, HSIAO-HUI
Exec Dt:
02/09/2011
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 2
Reel/Frame:
042002/0705Recorded: 04/13/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
WANG, WEN-DE
Exec Dt:
02/17/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE, STE. 700
DALLAS, TX 75219

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