Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14815625
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Filing Dt:
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07/31/2015
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Publication #:
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Pub Dt:
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02/04/2016
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Inventors:
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Feng Q. Liu, Ben-Li Sheu, David Thompson, Mei Chang, Paul F. Ma, David Knapp et al
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Title:
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HIGH THROUGH-PUT AND LOW TEMPERATURE ALD COPPER DEPOSITION AND INTEGRATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| SERVILLA WHITNEY LLC |
| 33 WOOD AVENUE SOUTH |
| SUITE 830 |
| ISELIN, NJ 08830 |
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