Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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14783370
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Filing Dt:
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10/08/2015
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Publication #:
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Pub Dt:
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02/25/2016
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Inventors:
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Tomoyuki ADANIYA, Kunio YUBE, Satoshi TAMAI
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Title:
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LIQUID COMPOSITION USED IN ETCHING COPPER - AND TITANIUM - CONTAINING MULTILAYER FILM, ETCHING METHOD IN WHICH SAID COMPOSITION IS USED, METHOD FOR MANUFACTURING MULTILAYER-FILM WIRING, AND SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MITSUBISHI BUILDING, 5-2, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8324 |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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