Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14780121
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Filing Dt:
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09/25/2015
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Publication #:
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Pub Dt:
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02/25/2016
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Inventors:
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Takuya TAKAHASHI, Takahiro YOSHII, Tomoko HATSUKADE, Takehiro ZUSHI
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Title:
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ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH CONTAINING SAID ADDITIVE, AND COPPER ELECTROPLATING METHOD USING SAID COPPER ELECTROPLATING BATH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU |
TOKYO, JAPAN 116-8554 |
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WENDEROTH, LIND & PONACK, LLP |
1030 15TH STREET, N.W. |
SUITE 400 EAST |
WASHINGTON, DC 20005 |
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