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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/05/2017
Application #:
14817924
Filing Dt:
08/04/2015
Publication #:
Pub Dt:
03/10/2016
Inventors:
Takahiro HASHIMOTO, Kenichi ONO, Michiaki MURATA, Hideyuki IKOMA, Tsutomu OTSUKA
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP THAT INCLUDES DIVIDING SUBSTRATE BY ETCHING GROOVE ALONG CUTTING REGION OF SUBSTRATE COMBINED WITH FORMING MODIFIED REGION BY LASER IRRADIATING ALONG CUTTING REGION IN SUBSTRATE
Assignment: 1
Reel/Frame:
036250/0418Recorded: 08/04/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/09/2015
Exec Dt:
07/09/2015
Exec Dt:
07/09/2015
Exec Dt:
07/09/2015
Exec Dt:
07/09/2015
Assignee:
7-3, AKASAKA 9-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
SUGHRUE MION PLLC
2100 PENNSYLVANIA AVE NW
SUITE 800
WASHINGTON, DC 20037
Assignment: 2
Reel/Frame:
058287/0056Recorded: 08/12/2021Pages: 157
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/01/2021
Assignee:
9-7-3, AKASAKA, MINATO-KU
TOKYO, JAPAN
Correspondent:
MARSHALL, GERSTEIN & BORUN LLP
233 SOUTH WACKER DRIVE
CHICAGO, IL 60606

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