Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14849639
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Filing Dt:
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09/10/2015
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Publication #:
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Pub Dt:
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03/17/2016
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Inventors:
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Kuan-Wei Chuang, Shih-Kuang Chiu, Chun-Tang Lin, Jung-Pang Huang
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Title:
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SEMICONDUCTOR PACKAGE, CARRIER STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
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