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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/13/2016
Application #:
14724374
Filing Dt:
05/28/2015
Publication #:
Pub Dt:
03/31/2016
Inventors:
Teruo Sasagawa, Junghun Chae, Jasper Lodewyk Steyn, Takeshi Hara, Asahi Yamato
Title:
PASSIVATED MICROELECTROMECHANICAL STRUCTURES AND METHODS
Assignment: 1
Reel/Frame:
036308/0467Recorded: 08/12/2015Pages: 17
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/09/2015
Exec Dt:
08/03/2015
Exec Dt:
08/03/2015
Exec Dt:
08/05/2015
Exec Dt:
08/05/2015
Assignees:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121-1714
22-22 NAGAIKE-CHO, ABENO-KU
OSAKA-SHI
OSAKA, JAPAN 545-8522
Correspondent:
WEAVER AUSTIN VILLENEUVE & SAMPSON, LLP
P.O. BOX 70250
OAKLAND, CA 94612-0250
Assignment: 2
Reel/Frame:
039905/0188Recorded: 09/02/2016Pages: 133
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/01/2016
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121

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