Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/14/2020
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Application #:
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14524225
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Filing Dt:
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10/27/2014
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Publication #:
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Pub Dt:
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04/28/2016
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Inventors:
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Yi Kei LAW, Pak Kin LEUNG, Chuek Wah TANG, Gary Peter WIDDOWSON
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Title:
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BOND HEAD COOLING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL |
| CASTLE STREET , LIBERATION HOUSE |
| ST HELIER, JERSEY, JE1 1BL JERSEY |
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