Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14919357
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Filing Dt:
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10/21/2015
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Publication #:
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Pub Dt:
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04/28/2016
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Inventors:
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HAJIME MOMOI, SATORU MORIOKA, TOSHIYUKI ONO, HIDETA ARAI, RYO FUKUCHI, ATSUSHI MIKI
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Title:
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Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 1008164 |
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| DRINKER BIDDLE & REATH LLP, IP DEPT. |
| ONE LOGAN SQUARE, STE. 2000 |
| PHILADELPHIA, PA 19103 |
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Assignment:
2
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| 1-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE ST |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
3
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| 10-4, TORANOMON 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 100-8164 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE ST |
| ST HELIER, JE1 1BL JERSEY |
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04/28/2024 05:34 PM
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