Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/22/2016
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Application #:
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14926649
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Filing Dt:
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10/29/2015
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Publication #:
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Pub Dt:
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05/05/2016
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Inventor:
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LEI SHI
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Title:
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FLIP-CHIP ON LEADFRAME SEMICONDUCTOR PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 288, CHONGCHUAN ROAD |
| NANTONG, CHINA 226006 |
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| ANOVA LAW GROUP, PLLC |
| 21351 GENTRY DRIVE, SUITE 150 |
| STERLING, VA 20166 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO. 288, CHONGCHUAN ROAD, |
| NANTONG, CHINA 226006 |
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| ANOVA LAW GROUP, PLLC |
| 21351 GENTRY DRIVE, SUITE 150 |
| STERLING, VA 20166 |
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