Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2019
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Application #:
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14935642
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Filing Dt:
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11/09/2015
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Publication #:
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Pub Dt:
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05/12/2016
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Inventors:
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Felix KOCH, Botho HOFFMANN
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Title:
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POLYAMIDE MOULDING COMPOUND, MOULDED ARTICLE PRODUCED HEREFROM AND ALSO PURPOSES OF USE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VIA INNOVATIVA 1 |
| DOMAT/EMS, SWITZERLAND 7013 |
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| LEYDIG VOIT & MAYER, LTD |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 NORTH STETSON AVENUE |
| CHICAGO, IL 60601-6731 |
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