Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15002566
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Filing Dt:
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01/21/2016
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Publication #:
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Pub Dt:
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05/19/2016
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Inventor:
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Satoshi SUZUKI
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Title:
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DECAPSULATION METHOD AND DECAPSULATION SYSTEM FOR PLASTIC MOLDED IC PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-22-3, SINGASHI, ITABASHI-KU |
| TOKYO, JAPAN 1750081 |
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| TYPHA IP LLC |
| 1875 I STREET NW SUITE 523 |
| WASHINGTON, DC 20006 |
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