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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
15012879
Filing Dt:
02/02/2016
Publication #:
Pub Dt:
05/26/2016
Inventors:
Rezaur Rahman KHAN, Sam Ziqun ZHAO
Title:
Method and Apparatus for Cooling Semiconductor Device Hot Blocks and Large Scale Integrated Circuit (IC) Using Integrated Interposer for IC Packages
Assignment: 1
Reel/Frame:
037640/0135Recorded: 02/02/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/18/2006
Exec Dt:
08/18/2006
Assignee:
5300 CALIFORNIA AVENUE
IRVINE, CALIFORNIA 92617
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C
1100 NEW YORK AVENUE, N.W.
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
041706/0001Recorded: 02/01/2017Pages: 1061
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/20/2017
Assignee:
1 YISHUN AVENUE 7
., SINGAPORE 768923
Correspondent:
OBLON, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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