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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/07/2017
Application #:
14800607
Filing Dt:
07/15/2015
Publication #:
Pub Dt:
05/26/2016
Inventors:
Kyoung-Kook HONG, Hyun Woo NOH, Youngkyun JUNG, Dae Hwan CHUN, Jong Seok LEE, Su Bin KANG
Title:
METHOD FOR BONDING WITH A SILVER PASTE
Assignment: 1
Reel/Frame:
037644/0453Recorded: 02/02/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/12/2015
Exec Dt:
05/12/2015
Exec Dt:
05/12/2015
Exec Dt:
05/12/2015
Exec Dt:
05/12/2015
Exec Dt:
05/12/2015
Assignee:
12, HEOLLEUNG-RO, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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