Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2017
|
Application #:
|
15005220
|
Filing Dt:
|
01/25/2016
|
|
Publication #:
|
|
Pub Dt:
|
06/02/2016
| | | | |
|
Inventors:
|
Hong Shen, Liang Wang, Rajesh Katkar
|
|
Title:
|
INTERPOSERS WITH CIRCUIT MODULES ENCAPSULATED BY MOLDABLE MATERIAL IN A CAVITY, AND METHODS OF FABRICATION
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
|
|
|
|
| HAYNES & BOONE, LLP (48259) |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 20 KING STREET WEST, 4TH FLOOR |
| TORONTO, CANADA M5H 1C4 |
|
|
|
|
| CHRISTINE DIONNE C/O PAUL HASTINGS LLP |
| 200 PARK AVENUE |
| 28TH FLOOR |
| NEW YORK, NY 10166 |
|
|
Search Results as of:
05/08/2024 11:59 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
