Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2017
|
Application #:
|
14743451
|
Filing Dt:
|
06/18/2015
|
|
Publication #:
|
|
Pub Dt:
|
06/09/2016
| | | | |
|
Inventors:
|
Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE PAD AND METHODS OF FORMING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
|
|
|
|
| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
|
|
Search Results as of:
05/21/2024 07:04 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
