Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14901547
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Filing Dt:
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12/28/2015
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Publication #:
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Pub Dt:
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06/09/2016
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Inventors:
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Steve Xin Liang, Chih-Chung Lilang, Yu-Bin Lin, Youhai Zhang, Yaqin Wang
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Title:
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PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BOARD STRUCTURE AND TECHNIQUE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 78 CHANGSHAN RD., JIANGYIN WUXI |
| JIANGSU, CHINA 214434 |
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| AILEEN M. RAYMOND |
| 350 WEST MICHIGAN AVENUE, SUITE 330 |
| KALAMAZOO, MI 49007 |
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