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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
14801099
Filing Dt:
07/16/2015
Publication #:
Pub Dt:
06/09/2016
Inventors:
Shih-Ping Hsu, Tang-I Wu
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
036111/0863Recorded: 07/16/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/20/2015
Exec Dt:
01/15/2015
Assignee:
NO. 458-17, XINXING RD.
HOKOU TOWNSHIP
HSINCHU COUNTY 303, TAIWAN
Correspondent:
GREGORY TUROCY
127 PUBLIC SQUARE
57TH FLOOR, KEY TOWER
CLEVELAND, OH 44114
Assignment: 2
Reel/Frame:
038745/0171Recorded: 05/17/2016Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 036111 FRAME: 0863. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
01/20/2015
Exec Dt:
01/15/2015
Assignee:
NO. 458-17, XINXING RD., HUKOU TOWNSHIP
HSINCHU COUNTY 303, TAIWAN
Correspondent:
AMIN, TUROCY & WATSON, LLP
57TH FLOOR, KEY TOWER
127 PUBLIC SQUARE
CLEVELAND, OH 44114

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