Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15045758
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Filing Dt:
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02/17/2016
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Publication #:
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Pub Dt:
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06/09/2016
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Inventors:
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Naoki SEKINE, Yasuo NAGASHIMA, Yoshihito HAGIWARA, Koichi TAKAHASHI, Motoki NAKAZAWA
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Title:
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WIRE BONDING APPARATUS AND BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI |
| TOKYO, JAPAN 208-8585 |
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| KATTEN MUCHIN ROSENMAN LLP |
| 575 MADISON AVENUE |
| 15TH FLOOR, IP DEPT. |
| NEW YORK, NY 10022-2585 |
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