Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/17/2019
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Application #:
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14907010
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Filing Dt:
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01/22/2016
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Publication #:
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Pub Dt:
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06/16/2016
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Inventors:
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Kiyonobu IDA, Mitsuru WATANABE
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Title:
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Metallic Copper Dispersion, Method For Manufacturing Same, And Usage For Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-15, EDOBORI 1-CHOME, NISHI-KU, OSAKA-SHI |
| OSAKA, JAPAN |
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| MANELLI SELTER PLLC |
| 2000 M STREET, NW |
| SUITE 760 |
| WASHINGTON, DC 20036-3307 |
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