Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2017
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Application #:
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14881058
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Filing Dt:
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10/12/2015
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Publication #:
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Pub Dt:
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06/16/2016
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Inventors:
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Andrei A. Shkel, Alexandra Efimovskaya
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Title:
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THROUGH-WAFER INTERCONNECTS FOR MEMS DOUBLE-SIDED FABRICATION PROCESS (TWIDS)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1111 FRANKLIN ST. 5TH FLOOR |
| OAKLAND, CALIFORNIA 94607 |
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| DANIEL L. DAWES |
| 5200 WARNER AVE STE 106 |
| HUNTINGTON BEACH, CA 92649 |
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