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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/18/2017
Application #:
15048106
Filing Dt:
02/19/2016
Publication #:
Pub Dt:
06/16/2016
Inventors:
Adam M. Kennedy, Stephen H. Black, Thomas Allan Kocian, Buu Q. Diep, Tse E. Wong et al
Title:
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
Assignment: 1
Reel/Frame:
037820/0752Recorded: 02/25/2016Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/05/2014
Exec Dt:
09/04/2014
Exec Dt:
08/21/2014
Exec Dt:
08/21/2014
Exec Dt:
09/04/2014
Exec Dt:
09/10/2014
Assignee:
870 WINTER STREET
WALTHAM, MASSACHUSETTS 02451-1449
Correspondent:
DALY, CROWLEY, MOFFORD & DURKEE, LLP
354A TURNPIKE STREET
SUITE 301A
CANTON, MA 02021-2714

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