Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2017
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Application #:
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15047793
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Filing Dt:
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02/19/2016
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Publication #:
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Pub Dt:
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06/16/2016
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Inventors:
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Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien et al
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Title:
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CMP-FRIENDLY COATINGS FOR PLANAR RECESSING OR REMOVING OF VARIABLE-HEIGHT LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & ASSOCIATES, LLC. |
| 629 EUCLID AVENUE, SUITE 1000 |
| NATIONAL CITY BANK BUILDING |
| CLEVELAND, OH 44114 |
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