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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/19/2016
Application #:
13689531
Filing Dt:
11/29/2012
Publication #:
Pub Dt:
06/16/2016
Inventor:
Saravuth Sirinorakul
Title:
POST-MOLD FOR SEMICONDUCTOR PACKAGE HAVING EXPOSED TRACES
Assignment: 1
Reel/Frame:
029377/0269Recorded: 11/29/2012Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/29/2012
Assignee:
237 LASALLE ROAD
BANGNA, BANGKOK, THAILAND 10260
Correspondent:
THOMAS B. HAVERSTOCK
162 N WOLFE ROAD
SUNNYVALE, CA 94086
Assignment: 2
Reel/Frame:
044012/0619Recorded: 11/01/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/08/2015
Assignee:
22 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569506
Correspondent:
HORIZON IP PTE. LTD.
7500A BEACH ROAD, #04-306/308
THE PLAZA
SINGAPORE, 199591 SINGAPORE

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