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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14581280
Filing Dt:
12/23/2014
Publication #:
20160181222
Pub Dt:
06/23/2016
Inventors:
Mohit Sood, Wei Tan, George F. Robinson, Hin Huat Teoh, Tean Wee Ong, Ha Ong Wong et al
Title:
PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
034668/0918Recorded: 01/08/2015Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SOOD, MOHIT
Exec Dt:
12/19/2014
TAN, WEI
Exec Dt:
12/22/2014
ROBINSON, GEORGE F.
Exec Dt:
12/18/2014
TEOH, HIN HUAT
Exec Dt:
12/22/2014
ONG, TEAN WEE
Exec Dt:
12/22/2014
WONG, HA ONG
Exec Dt:
12/19/2014
EE, BOON YEE
Exec Dt:
12/22/2014
HONG, KOK BENG
Exec Dt:
12/22/2014
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWABE, WILLIAMSON & WYATT, P.C.
1211 SW 5TH AVENUE, SUITE 160
PORTLAND, OR 97204

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