Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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14584223
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Filing Dt:
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12/29/2014
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Publication #:
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Pub Dt:
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06/30/2016
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Inventors:
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Chiwai LO, Shenkuang CHOU, Yiusing HO, Kayip WONG, Xiangyuan TAN, Junqun ZHANG
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Title:
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NOZZLE FOR CONNECTING OR DISCONNECTING SOLDER JOINTS BETWEEN HEAD BONDING PADS IN A HARD DISK DRIVE, AND LASER SOLDERING OR REFLOWING TOOL WITH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, CHINA |
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| NIXON & VANDERHYE, PC |
| 901 NORTH GLEBE ROAD, 11TH FLOOR |
| ARLINGTON, VA 22203 |
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