Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/09/2017
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Application #:
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14979102
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Filing Dt:
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12/22/2015
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Publication #:
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Pub Dt:
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06/30/2016
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Inventors:
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Hiroyuki Yasuda, Michihiro Sugo, Shohei Tagami, Masahito Tanabe
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Title:
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WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
| 1250 CONNECTICUT AVENUE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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