Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/12/2018
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Application #:
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14582758
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Filing Dt:
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12/24/2014
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Publication #:
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Pub Dt:
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06/30/2016
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Inventors:
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Jean-Michel GREBET, Wee Chin Judy LIM
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Title:
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CHIP SCALE PACKAGE CAMERA MODULE WITH GLASS INTERPOSER HAVING LATERAL CONDUCTIVE TRACES BETWEEN A FIRST AND SECOND GLASS LAYER AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| CHARLES C. HAGADORN III |
| SEED IP LAW GROUP |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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