Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/09/2018
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Application #:
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14916289
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Filing Dt:
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03/03/2016
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Publication #:
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Pub Dt:
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07/07/2016
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Inventors:
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Hiroji AGA, Isao YOKOKAWA, Hiroshi FUJISAWA
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Title:
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METHOD FOR MANUFACTURING BONDED WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 1525 MCCARTHY BLVD., #1182 |
| MILPITAS, CALIFORNIA 95035 |
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| CONSTANCE GALL RHEBERGEN |
| 711 LOUISIANA STREET, STE. 2300 |
| HOUSTON, TX 77002 |
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