Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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14589094
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Filing Dt:
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01/05/2015
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Publication #:
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Pub Dt:
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07/07/2016
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Inventor:
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Wing Shenq WONG
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Title:
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INTEGRATED CIRCUIT (IC) PACKAGE WITH THICK DIE PAD FUNCTIONING AS A HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2, |
| SINGAPORE,, SINGAPORE 569508 |
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| MICHAEL W. TAYLOR |
| 255 S. ORANGE AVE. |
| SUITE 1401 |
| ORLANDO, FL 32801 |
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