Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15075602
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Filing Dt:
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03/21/2016
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Publication #:
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Pub Dt:
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07/14/2016
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Inventors:
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Masahiko ABE, Koji WATANABE, Hideaki TAKAHASHI, Masahiko KANNO, Masaya ITO
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Title:
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SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| DONALD B. HASLETT/LAURA DONNELLEY |
| CHERNOFF VILHAUER MCCLUNG & STENZEL LLP |
| 601 SW SECOND AVENUE, SUITE 1600 |
| PORTLAND, OR 97204 |
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